Because of product characteristics, the automation of semiconductor manufacturing related industries has always been among the best in comparison with other manufacturing industries. But to transit from automation to intelligent manufacturing, i.e. from Industry 3.0 to Industry 4.0, and to achieve digital transformation, that is another story altogether.
In an interview with Micro-Electronics Magazine, SESTO Robotics CEO Michael Leong shares on the semiconductor industry’s trends and why he feels that assembly and packaging factories are moving towards full automation.
Click here to read the original article in Traditional Chinese and an English translation of an excerpt of the article.